On May 20, 2025, the global technology extravaganza, the Taipei International Computer Show, kicked off. Driven by the dual forces of the commercialization of trillion-parameter large models and the exponential growth of computing power demand, storage technology has evolved from a mere data carrier to a critical enabler for the deep integration of AI capabilities. TWSC demonstrates the transformative power of storage technology through edge-side adaptation solutions, full-stack technology integration, and global expansion.
I. Edge AI: Breakthroughs in Both Performance and Energy Efficiency
1. High-Performance Storage Matrix: The Foundation of AI PC Computing Power
(1) PCIe 5.0 SSD: TWSC adopts the next-generation PCIe 5.0 x4 interface, achieving continuous read/write speeds exceeding 14GB/s, supporting real-time loading of trillion-parameter models, and compatible with 3D TLC flash memory with over 200 layers, meeting high-throughput requirements.
(2) DDR5 Memory Modules: With a maximum capacity of 128GB, they support one-click overclocking technology with frequencies up to 10,000+ MHz, double the bandwidth of DDR4 in dual-channel mode, and dynamic voltage regulation technology that reduces power consumption by 20%. They are compatible with Intel, AMD, and domestic platforms, meeting the requirements for local large-scale model inference.
2. Embedded Storage: Enabling AI Devices to Operate Lightly
(1) UFS 3.1: With a maximum sequential read/write speed of 2000MB/s, it introduces Write Booster technology and Host Performance Booster (HPB), providing real-time data response capabilities for AR/VR devices.
(2) LPDDR5: Supports multi-bank mode with a data transfer rate of up to 5500Mbps. It reduces power consumption through Dynamic Voltage and Frequency Scaling (DVFS) functionality, making it suitable for mobile devices and high-performance computing platforms with high data processing speed requirements.
II. Full-stack technology empowerment: Reconstructing the value chain from chip to application
TWSC leverages its self-developed controller chip advantages to deeply integrate upstream and downstream resources in the storage industry chain, establishing full-stack capabilities spanning storage hardware, system algorithms, and industry solutions.
1.One-stop Customized Services: Precise Implementation from Wafer to Application
(1) Full-process Independent Development: Covering medium characteristic analysis, main control chip design, firmware algorithm optimization, and packaging control to meet the differentiated needs of four major application scenarios;
(2) Agile Demand Response: Leveraging strategic original manufacturer resources and a stable supply chain, we achieve rapid conversion from prototype design to mass production, deepening our global “5+1+N” supply chain layout to accommodate customized development needs.
(3) Full Lifecycle Quality Assurance
- End-to-End R&D Verification System: We have established a triple verification system and a cluster of professional laboratories, integrating high-precision instruments and intelligent analysis platforms to empower production, achieving dynamic alignment between product characteristics and application requirements.
- Dynamic Quality Control System: Coordinate end-to-end areas of the supply chain to establish a trustworthy and preventive manufacturing quality management system, enabling full-chain quality traceability from wafer selection to final delivery.
From chips to scenarios, from data to value. TWSC will continue to explore the path of AI industrialization, driving the upgrade of storage technology from basic functions to intelligent service value, and creating an efficient and reliable data foundation for industries across all sectors.
