“Intelligent Storage Without Borders” Drives Industrial Upgrades: TWSC's Full-Stack Solutions Debut at MemoryS 2025：
On March 12, 2025, MemoryS 2025 was successfully held in Shenzhen. The summit brought together global storage industry chain enterprises and core application vendors. TWSC showcased its full-stack storage solutions for embedded, industrial-grade, and consumer-grade applications, offering efficient, scenario-defined storage solutions through “independent R&D + global collaboration” to accelerate intelligent upgrades and unlock data value.
Focusing on Intelligent Storage: Dual-Track Approach of Technological Breakthroughs and Market Expansion
Currently, the core breakthroughs in intelligent storage technology have shifted from single-point hardware performance optimization to a full-stack capability reconstruction centered on “scenario-defined products.” TWSC positions embedded storage as a new growth engine and industrial-grade storage as an extension of scenario-based capabilities. Through collaborative innovation between self-developed chips and algorithms, the company integrates vertical technical capabilities.
1. Embedded Storage:
Diverse Product Portfolio Empowering High-Growth Scenarios TWSC has established a complete embedded storage product portfolio, focusing on the long-term durability requirements of emerging smart wearable devices, covering mainstream solutions such as UFS, LPDDR, and eMMC. Among these, the UFS 3.1 solution delivers 2,000 MB/s continuous read performance, providing stable support for high-concurrency data processing in edge AI devices. LPDDR5 achieves 6,400 Mbps data transfer rates with 30% power consumption optimization, efficiently addressing multi-task challenges in high-load scenarios. Looking ahead, TWSC will expand into emerging markets such as TV and AIoT, leveraging its self-developed technologies and supply chain integration capabilities to accelerate the implementation of intelligent scenarios.
2. Industrial-grade storage debut: Differentiated solutions break through in demanding scenarios
TWSC's first industrial-grade storage solution became the focus of the summit. Focusing on high-value fields such as smart manufacturing, smart transportation, energy and power, and network communications, TWSC leveraged its full-stack capabilities of “controller chips + firmware algorithms + customized services” to launch industry-specific solutions and build differentiated technical barriers. The ability to develop proprietary main control chips is key to building a full-stack intelligent storage ecosystem. TWSC uses its self-developed SATA SSD main control chip as the core to create industrial-grade SSD solutions compatible with domestic substitution. Through large-scale supply chain integration and an efficient delivery system, it addresses industrial customers' pain points regarding long-term stable supply, driving the large-scale application and coordinated development of domestic industrial storage solutions.
Global Expansion: Resilient Supply Chain Empowering High-End Competitiveness
TWSC adopts a “4+1+N” global layout strategy, leveraging multi-location R&D collaboration and intelligent production systems to rapidly adapt to high-value sectors such as industrial automation and AI servers. Through its global marketing network, the company dynamically captures market demand, combining flexible supply chain management and agile delivery capabilities to transform technological advantages into global competitiveness for high-performance storage solutions. This approach continuously strengthens its differentiated brand momentum in the high-end market.
As the storage industry enters a new round of AI technology iteration, TWSC will seize the opportunity presented by AI-driven storage upgrades to optimize product offerings, launch high-reliability solutions, deepen collaborations in industrial control, smart wearables, and consumer electronics ecosystems, and accelerate global intelligent transformation through storage support.
