On July 17, the Rockchip Developer Conference 2025 was held in Fuzhou. As a core contributor to Rockchip's AIoT ecosystem, TWSC attended the conference, showcasing its full-stack embedded storage products and solutions. The company engaged in discussions with developers and ecosystem partners on the latest development insights, providing high-performance storage support for smart device innovation and digital transformation across industries.
Intelligence is redefined by connectivity; storage enables seamless connectivity
As traditional IoT networks upgrade to AIoT intelligent entities, efficient data flow has become the core of end-to-end intelligent collaboration. At the Rockchip Developer Conference, TWSC showcased embedded storage solutions certified on over 30 platforms, including the RK3588 and RK3568.
1. Scene-specific performance verification:
- LPDDR4X memory bandwidth reaches 4266Mbps, supporting real-time analysis of 8K smart IP cameras
- eMMC 5.1 achieves sustained read/write speeds of up to 320 MB/s, meeting the multi-screen interaction requirements of smart cockpits.
2. Mass Production Scenario Assurance：
With embedded storage products verified for performance, stability, and compatibility, TWSC has achieved large-scale application in full-scenario intelligent business scenarios such as security surveillance, smart speakers, and mobile terminals, laying a solid technical foundation for decentralized network connectivity and the intelligent interconnection of all things.
Accelerating AIoT Ecosystem Deployment and Empowering Next-Generation Intelligent Devices with Storage Capabilities
As a leading domestic AIoT solution provider for smart terminals, Rockchip has aggregated over 300 ecosystem partners through its open Rockchip platform to build a robust technical ecosystem. Deminli relies on strict quality control processes and component certification systems to provide a full product matrix of cross-platform compatible UFS, LPDDR, and eMMC embedded storage solutions, covering requirements from edge computing nodes to complex smart terminals. It builds software and hardware co-development kits to ensure that storage products achieve industry-leading levels in key metrics such as consistency and durability, better empowering domestic users' diverse storage needs.
Looking toward the new era of intelligent connectivity, TWSC will deepen its collaboration with Rockchip in areas such as technological innovation, industrial applications, and commercial partnerships, accelerating chip adaptation processes. Through AI+ system-level integration and innovation, TWSC aims to provide AIoT devices with seamless storage experiences.
